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? data device corporation 105 wilbur place bohemia, new york 11716 631-567-5600 fax: 631-567-7358 www.ddc-web.com for more information contact: technical support: 1-800-ddc-5757 ext. 7771 features ? low cost continuously programmable and preset ranges emi tolerant i 2 t & instant trip protection mil-std-704 compliant opto-isolated control circuitry no thermal derating low power dissipation thermal memory coordinated tripping characteristics description the rp-21200 star series of 28 vdc solid-state power controllers (sspcs) replace electromagnetic circuit breakers and solid-state relays r ated from 1 through 25 amperes. these sspcs provide status outputs and logic input control so that they may be remotely located near the load. the 28 vdc sspcs are available in three programmable current ranges; 1-3 amperes, 3-9 amperes, and 8.3-25 amperes. each of these ranges offer four preset current settings and allow the user to set other ranges. the primary function of the sspc is to protect the wire from i2r heat- ing. the sspc uses standard logic i/o, ?on/off? logic input controls, provides isolation between the control side and power side, and has status outputs. the device is contained in a non-flammable housing and is electrically shock proof. it has self contained sspc functions including thermal memory. the rp-21200 star series are pc board through-hole or surface-mountable lightweight encapsulated devices that are impervious to moisture. using power mosfet switches, these power controllers offer low ?on? resistance, low voltage drop, high ?off? impedance, and low power dissipation. built using the latest plastic and epoxy technolo- gies, they offer small size, low power, and high reliability. applications designed to replace circuit breakers in land, air, sea, and space vehi- cles, these sspcs provide status outputs, which show switch state and minimum load current. an optional analog current monitor can report load current. fault tolerant systems can be configured using these sspcs with a remote or local cpu. ? 2000 data device corporation rp-21200 star series? s olid-st ate a dvanced r emote power controllers make sure the next card you purchase has...
2 data device corporation www.ddc-web.com rp-21200 d-02/04-0 figure 1. star series block diagram vbias supply input isolated control circuit status1 vbias supply common mosfet driver, short circuit control, status circuit, and latches internal power supply r sense power in power out slew control high side switch config. low side switch config. +28 vdc +28 vdc load load or system gnd power in power out slew control control cmd status2 lock-out range program (r 1 ) load detection program (r 2 ) optional analog current output instant trip program (r 3 ) opto- isolation program reference v ref i i 3 2 transformer isolation vcc chassis (base) ground optional battle short control
3 data device corporation www.ddc-web.com rp-21200 d-02/04-0 output reverse pulsed current all models pulse width 100 s a 4x max. rated current output reverse voltage at rated current power out voltage > power in voltage v 1.8 max. output voltage drop at 25c see note 3 see table 4 v 0.2 max. output voltage drop at 100c see note 3 see table 4 v 0.3 max. trip characteristics see figure 5 -55c to +100c ?? i 2 t max rating calculation response time instant trip=200% see figure 5 instant trip=1000% see figure 5 instant trip=3000% see figure 5 see figure 6 -55c to +100c a 2 - sec a 2 - sec a 2 - sec ? 1.4 x i rated current 2 4.2 x i rated current 2 10.6 x i rated current 2 ? total gamma dose (note 6) rp-212xx?f0? rad(si) 10k neutron fluence (note 6) rp-212xx?f0? n/cm 2 3.2 x 10 12 gamma dose rate (note 6) rp-212xx?f0? rad(si) /sec <10 12 (note 7) power input leakage current to power out rp-21225 parameter power in = 0-40 v -55c to +100c see note 5 conditions ma unit 4 max. value load capacitance rp-21225 load capacitance rp-21209 load capacitance rp-21203 see note 3 -55c to +100c see note 3 -55c to +100c see note 3 -55c to +100c f f f 6800 min. 1400 min. 700 min. control to power output isolation resistance control to power output = 50v ? 10 8 min. output reverse continuous current all models rupture capacity trip reset time output capacitance rp-21225 output capacitance rp-21209 output capacitance rp-21203 power out voltage > power in voltage see note 4 power in to power output = 28v power in to power output = 28v power in to power output = 28v a a ms pf pf pf 1x max. rated current unlimited 1 max. 6600 typ. 3300 typ. 900 typ. logic type parameter see figure 2 see note 2 condition ? unit ttl/cmos compatible value vbias supply current 8 v bias =4.5-5.5 v dc rp-212xxf1 v bias =4.5-5.5 v dc rp-212xxf0 ma ma 50 typ., 75 max. 20 typ. 30 max. control turn-on voltage 2 -55c to +100c v 2.0 min. control turn-off voltage 2 -55c to +100c v 0.8 max. lockout disable voltage 2 -55c to +100c v 2.0 min. lockout enable voltage 2 -55c to +100c v 0.8 max. control/lockout input current 2 control = 5 v lockout = 0 v -55c to +100c a a 100 max. -100 min. control/lockout input current 2 control = 0 v lockout = 5 v -55c to +100c a a 1.0 max. -1.0 min. status output voltage low v bias = 4.5 v i ol = 2.5 ma -55c to +100c v 0.4 max. status output voltage high v bias = 4.5 v i oh = -0.4 ma -55c to +100c v 3.5 min. status truth table see table 6 ? ? ?on? resistance see table 4 ? ? power dissipation see table 4 ? ? power input leakage current to power out rp-21203 power in = 0-40 v -55c to +100c see note 5 ma 0.3 max. parameter unit value power in to power out vdc 70 continuous 90 transient power out to slew control vdc 100 continuous lock-out input to signal ground 1 control input to signal ground 1 vdc vdc -0.5 to 7.0 -0.5 to 7.0 power out to signal ground vdc -100 to +100 vbias voltage vdc -0.5 to +6.0 lead temperature (soldering) c +260 (within 10 sec.) junction temperature c 125 table 1. absolute maximum ratings table 3. rp-212xx specifications table 3. rp-212xx specifications (cont.) note: 1. this input shall not exceed vbias by more than 0.5v. note: 1. this input shall not exceed vbias by more than 0.5v. table 2. recommended operating conditions power out to signal ground control input to signal ground 1 vbias voltage lock-out input to signal ground 1 power in to power out parameter vdc vdc vdc vdc vdc unit -40 to +40 +4.5 to +5.5 +4.5 to +5.5 +4.5 to +5.5 +0.0 to +40.0 value instant trip level without external programming resistor see figures 3 and 4 190 min. 210 max. % of rated current power in = 0-40 v -55c to +100c see note 5 ma 2 max. power input leakage current to power out rp-21209
4 data device corporation www.ddc-web.com rp-21200 d-02/04-0 table 3 notes: 1. all specifications are at 25c unless otherwise specified. maximum rated current is defined as the current when the r1 current range programming pin is shorted to the programming reference pin. 2. control and lockout operate the input optocoupler. they may be interchanged which will invert their function. see figure 2 for a schematic of this input structure. 3. limits are shown when programmed to maximum instant trip level, and at the maximum current rating setting. limits are 33% of those shown when there are no connections to r1, i2, and i3 programming pins (when at minimum current range, but maximum instant trip range). 4. this means that the sspc may be reset 1 ms after a trip has occurred. however, if the cause of the trip has not been removed, the second trip will occur faster than the first trip. this is an example of how the internal ?thermal memory? protects the wire. also, repeated resetting and tripping must not occur faster than 30 ms after the first reset in order to prevent overheating of the sspc. 5. ddc recommends using an external bleed resistor in situations that may not tolerate leakage currents that will permit power-in vdc at the load. 6. analytical radiation tolerance estimate. 7. the star series design incorporates series power supply resistors to protect against latch-up damage. 8. during initial power-on @ vbias ~ 3.5vdc, a transient current pulse of up to 100ma above the vbias supply current may be observed. functional description the rp-21200 star series of programmable solid-state power controllers (sspcs) are electronic circuit breakers and, as such, are primarily intended to protect the wiring between the power source and the load. they are designed to replace electro- mechanical or thermal circuit breakers while providing the relia- bility of solid-state electronics. unlike circuit breakers, sspcs can easily interface with ttl/cmos signals associated with solid-state controllers, such as embedded microprocessors. the block diagram in figure 1 shows the various functional blocks within the rp-212xxf1 series. the control side employs buffers for the logic signals, which are isolated and level shifted from the power side by optical isolation. on the power side are the analog and digital circuits which drive the power mosfet switch, sense the switch?s current and provide programmability. an internal dc-dc converter, powered by the control side 5 volt bias supply provides isolated power to the power side circuitry. an optional analog current monitor output uses optical isolation, and provides an analog voltage signal on the control side which is proportional to the switch?s (load) current. the star series has two ttl/cmos compatible inputs. one input is the control command. a logic high on the control command will turn on the power switch and a logic low will turn it off. the other input is a lockout input which can be used to provide safety during system maintenance. when the lockout input is at a logic high, the sspc is disabled and always off, regardless of the state of the control command input. when the lockout input is at a logic low, the sspc follows the state of the control command. the two ttl/cmos compatible outputs, status 1 and status 2, provide status information on the switch current (load current) and switch state, respectively. status 1 will be at a logic high when the switch current is less than the programmed load detection value - see figure 4 for programming information. when the switch current is greater than the programmed load detection value, status 1 will be at a logic low. status 2 reflects the state of the switch. when the switch is closed, status 2 will be at a logic high and when the switch is opened, status 2 will be at a logic low. the combination of the states of the control command, lockout input, status1 and status 2 outputs provide built-in-test (bit) capability. table 6 shows the possible status combinations. as in a circuit breaker, the sspc will carry continuous current up to a certain level without tripping. for the rp-21200 series, the sspc will not trip as long as the continuous current is less than 110% of the programmed current - see figure 4 and table 5 for programming information. the star series are guaranteed to trip if the continuous current is greater than 145% of the pro- grammed value. again, like a circuit breaker, the rp-21200 series can handle short duration overloads without tripping. the i 2 t curve shows that time to trip is inversely proportional to the square of the current. this means that short overloads can be large without tripping but longer overloads must be small to avoid tripping. figure 5 shows a typical set of i 2 t curves. operation parameter conditions value unit table 3. rp-212xx specifications (cont.) instant trip level with external programming resistor shorted see figures 3 and 4 2845 min. 3155 max. % of rated current load detection level without external programming resistor see figures 3 and 4 89 min. 101 max. % of rated current load detection level with ext. programming resistor shorted see figures 3 and 4 5 min. 15 max. % of rated current thermal resistance junction-to-case rp-21203 hottest die to base 3 max. c/w thermal resistance junction-to-case rp-21209 hottest die to base 1 max. c/w thermal resistance junction-to-case rp-21225 hottest die to base 0.5 max. c/w thermal resistance base-to-sink rp-21203 ? 1.8 max. c/w operating case temperature range ? -55 to +100 c thermal resistance base-to-sink rp-21209 ? 0.9 max. c/w thermal resistance base-to-sink rp-21225 ? 0.5 max. c/w thermal resistance base-to-ambient rp-21203 free air 25 max. c/w thermal resistance base-to-ambient rp-21209 free air 20 max. c/w thermal resistance base-to-ambient rp-21225 free air 15 max. c/w size see figure 8 ? ? weight rp-21203 weight rp-21209 weight rp-21225 ? ? ? 1.24 (35) 1.59 (45) 2.12 (60) oz (g) oz (g) oz (g) storage temperature ? -55 to +125 c mounting torque ? 5 in-lbs
5 data device corporation www.ddc-web.com rp-21200 d-02/04-0 control command lockout command biasgnd 100k 100k biasgnd rp-212xx r vbias figure 2. rp-212xx series control/lockout functional schematic rp-212xx i i 3 2 current range programming load detection programming instant trip programming program reference r r r 1 2 3 internal preset programming options figure 3. rp-212xx series programming connections in the area between the minimum and maximum curves is ambiguous; the sspc may or may not trip. a hot wire cannot withstand as great an overload as a cool wire. the star series of sspcs incorporate ?thermal memory? to protect a wire that is hot from a previous overload. the instant trip characteristic ranges shown in figure 5 are pro- grammable as detailed in figure 4. if the overload exceeds the upper instant trip level, the sspc will trip regardless of the dura- tion of the overload. the main reason for an instant trip level is to protect the switch from excessive short-term power dissipation but can be programmed for system considerations, if necessary. the rp-21200 star series are available in three current ranges. as shown in table 5, they are programmable over a three-to-one range. the ranges are: 1 - 3 amps, 3 - 9 amps and 8.3 to 25 amps. table 4 shows the maximum ?on? resistance and voltage drops over the temperature range. the rise and fall times of the output voltage are controlled to be approximately 500s. fast rise times minimize the power dissi- pation in the switch during turn-on and turn-off. slow rise times minimize emi, voltage spiking due to line inductance and allow starting up into higher capacitive loads. the 500s rise and fall times in the star series represent a compromise. while the switch can handle the power dissipation during occasional changes of state, rapidly switching the sspc on and off will lead to overheating. these sspcs should not be cycled at greater than a 30ms rate. to control the rise and fall time, the slew control input must be returned to chassis ground. the load return is the ideal chassis ground; the chassis ground can also be used as a ground but, if there is noise between chassis ground and load return, some of this noise may appear on the output. an alternative chassis ground is the power in but, if the power in is turned on abruptly, such as through a switch or contactor, the output may exhibit a small transient although the sspc is commanded off. min. rated current max. rated current part number ?on? resistance (ohms) voltage drop (v) power dissipation (w) voltage drop (v) power dissipation (w) rp-21203 0.100 0.1 0.25 0.3 1.05 rp-21209 0.033 0.1 0.45 0.3 2.85 rp-21225 0.012 0.1 0.98 0.3 7.65 table 4. power dissipation table 4 notes: 1. values shown are maximum over the case temperature range of -55c to +100c; typical values at 25c are typically 67% of the maximums shown above. 2. voltage drop is approximately 0.6% per c improved below the100c limit. 3. power dissipation data includes 150 mw contribution of vbias, but doesn?t include the analog current monitor (see table 3). ?f1? is another 45 ma maximum.
6 data device corporation www.ddc-web.com rp-21200 d-02/04-0 figure 4. star series programming curves rp unit open note 1a i3 note 1b i2 note 1c r1 note 1d rp-21203 1 1.5 2.4 3 rp-21225 rp-21209 8.3 3 12.5 4.5 20 7.2 25 9 table 5. preset programmed current ratings preset current settings (amperes): see note 2 notes: 1) the rp-212xx series current rating programming is as follows: a) minimum current is set by not connecting r1, i2, or i3. b) the first quarter program rating requires connecting i3 to the program reference pin. c) the third quarter program rating requires connecting i2 to the program reference pin. d) the maximum current rating is programmed by connecting the r1 pro- gramming pin to the program reference pin directly. 2) an external resistor connected between the r1 input range programming pin and program reference pin will provide infinite resolution current setting. reference figure 4 ( star series current programming curves). 0 20 40 60 80 100 120 10 100 1k 10k 100k 1m (r1) ohms % of maximum rated current set current (% of max) 0 20 40 60 80 100 10 100 1k 10k 100k 1m (r2) ohms % of rated current load detect (%) 0 500 1000 1500 2000 2500 10 100 1k 10k 100k (r3) ohms % of rated current instant trip (%) 3000 3500 1 applications information programming overview the three standard programmable devices of the rp-212xx star series are the rp-21203 (1-3 amp), rp-21209 (3-9 amp), and rp-21225 (8-25 amp). each supports a 3:1 current rating range. please refer to figure 3 (rp-212xx series programming connections), figure 4 (star series programming curves), and table 5 (preset current ratings for further details). the instant trip level is independently programmable from a nominal 200% to 3000% of the sspcs programmed current rat- ing. using the rp-21203 as an example, if the current rating range is programmed for 3 amps [by using external r1 = 0 (shorted)], then the instant trip will be programmed from 6 to 90 amps. on the other hand, if r1 = 4 (left open), the instant trip can be programmed from 2 to 30 amps. therefore, the instant trip level remains a fixed percentage of the current rating range. the status 1 load detect programming works the same way as the instant trip level programming. the range for the status 1 load detect is 10% to 95% of the sspcs programmed current rating. programming the star series can be programmed for current rating, instant trip level and load detection level. figures 3 and 4, table 5 and the programming explanation give detailed information on how to program these sspcs. the current rating for each of the rp-21200 series sspcs can be varied over a three-to-one range to tailor each application for the wire?s i2t rating as described above. the current rating can be programmed for any value in the range by using an external resistor. additionally, preset programmed current ratings of 50%, 80% and 100% of maximum rated current can be imple-
7 data device corporation www.ddc-web.com rp-21200 d-02/04-0 mented by simply connecting together the appropriate pins. a current rating of 33% of maximum rated current occurs with no programming connections. the load detection level determines the current which will con- trol the status 1 output. when the load current is below the load detection level, the status 1 output is at a logic high and goes low when the load current rises above the load detection level. therefore, the status 1 output can be used to determine if the load is drawing more or less than a preset amount of current. the load detection level can be programmed from >10% to <95% of rated current using an external resistor connected between the programming reference pin and load detection program pin. the 10% level can be achieved by simply connecting the programming reference pin and the load detection program pin together. the 95% level occurs when no connection is made to the load detection program pin. the star series have been designed with a maximum instant trip level of 3000% of rated current in order to protect the inter- nal mosfet switches from exceeding their rated junction tem- peratures. in most cases, the user will elect to set the instant trip level to the maximum by connecting the instant trip program pin to the programming reference pin. this will allow the greatest possible inrush current without tripping for charging capacitive loads, starting motors or energizing incandescent lamps. in some applications, where there is no need to support high inrush currents, the instant trip level can be set lower by adding a resistor between the instant trip program pin and the programming reference pin. the lowest instant trip level of 200% can be set by leaving the instant trip program pin open. the most likely reason for setting a low instant trip level is to minimize short-term voltage drops at the load due to high source impedances. in other cases, the generator has its own circuit breaker for protection and it?s better to trip an sspc than the generator. 5,000 3,000 1,000 200 100 load current % i-max 0.001 0.01 0.1 1 10 145% 110% time (seconds) always trip 0.0001 never trip maximum instant trip minimum instant trip figure 5. typical trip characteristic settings when an sspc is turned on into a short circuit, the output volt- age cannot rise. however, the output current will rise rapidly until the instant trip level is reached. then the sspc will turn off. the maximum transient current will not exceed the instant trip level, even if there is no circuit inductance, since the turn on time of the mosfet is controlled. since the output voltage is still zero, the output current will begin to decay as soon as the instant trip level is reached. the time for the current to decay is determined by the total circuit inductance and resistance. this is difficult to pre- dict since the resistance of the internal mosfet switch changes as it turns off. in any case, the turn off time is always fast enough to ignore for purposes of damaging the wire. if there is considerable circuit inductance when an sspc is turned on into a short circuit, the risetime of the current will be much slower than without inductance. large load inductance can stretch the risetime of the current to the point where the cur- rent does not reach the instant trip level but intersects the i 2 t curve instead. again, this cannot damage the wire as the sspc will trip at that point to protect the wire. if the sspc is already on and a short circuit occurs, the sspc will trip, but the short circuit current will likely overshoot the instant trip level. again, the rate of rise of the current depends on total circuit inductance. since the sspc is already on, the current can, theoretically, rise in zero time if there is no induc- tance. in the real world, there is always inductance which will limit the risetime of the current although it can be quite fast. as soon as the current reaches the instant trip level, the sspc will begin to turn off. however, since the sspc is already on, there is a delay until the gate-to-source voltage in the internal mosfet switch is reduced to the point where they begin to turn off. as a result, the current keeps rising during that delay. how much the current rises above the instant trip level is determined by the delay and the risetime of the current. the rp-21200 series of sspcs contain circuitry to reduce the delay at high currents. but, with lit-
8 data device corporation www.ddc-web.com rp-21200 d-02/04-0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 control input load current status 2 status 1 trip point note: *voltage rise/fall time is specified for maximum rated current. figure 6. solid-state power controller timing time description minimum unit maximum t1-t2 turn-on delay s 350 t2-t3 voltage rise time * 300 s 700 t1-t4 ms 7.5 t4-t5 status 1 & status 2 rise and fall time ns 50 t6-t7 turn off delay s 900 t7-t8 voltage fall time * 300 s 700 t6-t9 status 1 & status 2 turn off delay ms 5.0 t10-t11 trip time after turn-on s see fig 5 t11-t12 voltage fall time after trip* 300 s 700 t11-t13 trip turn-off status 1 delay ms 5.0 status 1 & status 2 turn on delay solid-state power controller timing at 28 vdc tle circuit inductance, the current can reach up to 4000% of rated current even if the instant trip level is set as low as 200%! this possible high level of transient current is short-term. the lower the circuit inductance, the higher the transient current but the shorter the transient lasts. in all cases, the wire is protected since the wire can withstand large overloads for short durations. the only concern is possible system effects of having large, short-term transient currents. generator tripping is unlikely since the transients are so fast. high side and low side switching most applications place the circuit breaker in the wire supplying power to the load, not in the load return wire; this is the ?high side switch? configuration. the rp-21200 series are designed to be placed in either ?high side? or ?low side? switch configura- tions. figure 1 shows both configurations. additionally, because the star series sspcs have complete isolation between the control and power sides, these sspcs can be used with either positive (as shown in figure 1), or negative power. to use these sspcs with negative power, the configurations in figure 1 are swapped. that is, the configuration of figure 1 showing ?high side switch? would be used for low side switching for negative input power and the configuration in figure 1 showing ?low side switch? would be used for high side switching for negative input power. for either high side or low side switch configurations, the ?ground? symbol in figure 1 would be replaced with the negative power input, -28vdc for instance, and the ?+28vdc? symbol would be replaced with ground. selection all wires carrying current have both continuous and transient rat- ings for maximum safe operating current. continuous ratings are usually expressed in amps and are dependent on the size of the wire as well as physical conditions around the wire such as whether or not the wire is in a bundle. transient ratings are expressed as an i 2 t product, which is a constant. sometimes, transient ratings are expressed as a pulse of current for a spec- ified duration. the i 2 t constant can be calculated from that data. both continuous and transient ratings depend on the allowable temperature rise of the wire which is dependent upon the type of insulation on the wire as well as overall system requirements. since the star series main function, like a circuit breaker, is to protect the wire and prevent fire damage, the sspc must have lower continuous and transient ratings than the wire?s ratings. the user must verify that the sspc?s trip curve falls below the
9 data device corporation www.ddc-web.com rp-21200 d-02/04-0 wire?s safe operating curve for all values of time. for the rp- 21200 series and continuous currents, this is simple. just spec- ify the sspc?s rated current to be below the wire?s continuous current rating by the required safety factor times 1.45. the 1.45 comes from the fact that the rp-21200 series is guaranteed to trip at 145% of rated current. since the rp-21200 series are available in three programmable ranges, it?s easy to tailor the star series to the wire. it?s even easier to select an rp-21200 series sspc for transient ratings. the star series i 2 t ratings are tailored to the continu- ous ratings so that, except for rare cases, the sspc i 2 t ratings will be below the wire?s ratings. this can be verified by compar- ing the rp-21200 series i 2 t rating in table 3 against the wire?s i 2 t rating. since the instant trip level has an effect on the shape of the i 2 t curves as shown in figure 5, table 3 shows the star series i 2 t rating for three levels of instant trip. simply select the rp-21200 series i 2 t rating for the instant trip level being used and multiply by the programmed rated current squared to obtain the i 2 t rating for the application. precautions while circuit inductance reduces current transients when a short circuit occurs with the star series of sspcs already on, it will create voltage transients as the sspc turns off. the voltage transient is caused by the rapid change in current in the induc- tance. if the inductance is on the power input side of the sspc, the voltage at the power in pin will rise when the sspc turns off. similarly, when the inductance is on the output side, the power out pin will swing negative when the sspc turns off. in the rp-21200 series, internal circuitry slows the turn off time of the sspc to minimize this voltage transient until the induc- tance, in microhenries, exceeds a critical inductance of 10,000 divided by the maximum rated current. (for an rp-21225 sspc with a maximum rated current of 25 amps, this equates to 400h.) at that level of inductance, the transient voltage will be about 45 v. for larger circuit inductances, the voltage tran- sient will grow linearly with inductance. in most cases, the inductance on the power in side of the sspc will be, at most, a few microhenries. therefore, the power in side will have only small transient voltages. on the other hand, the power out side can have considerable inductance from loads. a prime example is a motor. to protect the sspc with large induc- tive loads, a power diode should be placed between the sspc power out pin and the load return to prevent the sspc power out from swinging negatively. this diode should be rated to han- dle the same maximum transient current as described above for short circuit conditions. it should be connected with short leads; otherwise, the inductance of its leads will negate its benefits. since short circuits can create large transient currents, it?s pos- sible to magnetically couple those transients to the control side if wiring or circuit board traces of the power side run near those of the control side. it?s not impossible to couple many volts to the control side with poor layout. this will cause improper operation and possibly oscillation of the sspc which could damage the sspc. after all, coupling the output current to the control circuit is a form of feedback. since there is no control of the phase of the feedback, oscillation is possible. this may be hard to trace since, when there is no short circuit, everything appears normal but as soon as a short circuit occurs, the sspc fails. good lay- out practice will prevent this. likewise, large transient currents could magnetically couple voltage transients elsewhere in the system causing hard-to-trace system faults. large voltage transients could couple into high impedance system circuits, another possible system problem. also, these tran- sients could radiate elsewhere; while the system seems to pass its emi tests, it may only do so under certain conditions and fail under other conditions. routing of high current wiring and control signals must always be made while considering these effects. capacitive loads applying a voltage to a capacitor causes an inrush current to flow which depends on the rate-of-rise of the voltage and the value of the capacitor. since the star series has a typical risetime of 500s, the charging current will never intersect the i 2 t portion of the trip curve, but can intersect the instant trip level. if it does, the sspc will trip. table 3 specifies the capacitive load that the rp- 21200 series can handle without tripping with 28 volt power input. higher power input voltage will proportionally reduce that capaci- tive load capability since the risetime is independent of voltage. by carefully controlling the risetime of the output voltage, the rp- 21200 series provide a form of current limiting for capacitive loads. however, if an sspc is already on and an uncharged capacitive load is applied, i.e., through a switch, the sspc will trip. if, due to system requirements, this possibility exists, the solution is to use another sspc to switch the capacitive load. the risetime control of the second sspc will limit the current. as described earlier, the slew control must be connected to ac ground for this current limiting to function. in some situations, there may be a critical system load that must have power if the primary power bus fails. in that case, a second sspc may be used to switch power from a secondary power bus when the primary power bus drops. if the load cannot withstand the time for the second sspc to rise, the slew control on the second sspc may be left open which will speed up its risetime to about 75s. however, this will reduce the second sspc?s capacitive drive capability by a factor of approximately 7. risetimes between 75s and 500s can be programmed by using a voltage divider between the power out pin and ?ac? ground and connecting the slew control to the mid-point of the voltage divider. the calculated resistance of the two resistors of the voltage divider in parallel must be less than 1000 ohms. the capacitive load capability of an sspc used this way will be reduced by the same factor as the speed-up of risetime. reset when 5 volt bias power is applied, internal circuits are automat- ically reset. as a result, the sspc will correctly respond to the control command input and lockout input. when a trip occurs, the rp-21200 series are latched off. to reset the sspc, simply bring the control command input to a logic
10 data device corporation www.ddc-web.com rp-21200 d-02/04-0 low. subsequently bringing the control command input to a logic high will turn the sspc on again. thermal memory the i 2 t rating of a wire is based on the heating effect of current passing through the wire with the assumption that the wire was initially cool (unpowered). if a wire is already hot, its i 2 t rating is lower and, if the wire is already at its maximum temperature, its i 2 t rating is zero. the rp-21200 series has circuitry to create a ?thermal memory? to protect the wire under these conditions. the i 2 t ratings of the star series shown in table 3 apply only when the load current prior to the overload is zero, such as when the sspc is first turned on. if the load was drawing current prior to the overload, the trip time will be faster. if the sspc tripped due to an overload and the sspc is commanded to turn back on immediately, the trip will be almost instantaneous. however, if the sspc tripped due to an overload and sufficient time elapses for the wire to cool, the trip time will once again be the same as if the wire were initially unpowered. in this way, the ?thermal memory? protects the wire from repetitive overloads. status codes this section contains a fuller explanation of the conditions and meaning of the status codes shown in table 6. each paragraph number corresponds to the state in table 6. the first four conditions show the control input has commanded the sspc to be off: 1) the sspc has failed or shorted to ground. status 1 indi- cates the load is drawing current but the sspc should be off. 2) the sspc has failed. status 1 indicates the load is drawing current; status 2 indicates the power mosfet switch is on; the sspc should be off. 3) normal off condition. status 1 indicates the load is not draw- ing current; status 2 indicates the power mosfet switch is off. 4) the sspc has failed or status 2 has shorted to the bias sup- ply. status 1 indicates the load is not drawing current; status 2 indicates the power mosfet is on; the sspc should be off. the next four conditions show the control input has commanded the sspc to be on: 5) the sspc has failed or there is a short to ground on the sta- tus 2 output. status 1 indicates the load is drawing current but status 2 indicates the power mosfet switch is off. 6) normal on condition. status 1 indicates the load is drawing current and status 2 indicates the power mosfet switch is on. 7) tripped condition. status 1 indicates the load is not drawing current and status 2 indicates the power mosfet switch is off. the sspc can be turned back on by cycling the input con- trol to a logic low and then back to a logic high. if the excessive load has not been removed, the sspc will trip again. 8) no load current. status 1 indicates the load is not drawing current; status 2 indicates the power mosfet switch is on. heatsinking the star series are designed so that the junction temperature of its components can never exceed their maximum ratings if the baseplate temperature is held to 100 c or less. heat sinking may be required at high ambient temperatures. the maximum ambient temperature (ta) for operation without a heat sink is 100 - pd x ca (where pd is the power dissipation and ca is the thermal resistance from case-to-ambient from table 3). note that table 4 specifies maximum power dissipation assuming maximum baseplate temperature and a current equal to rated current. since all systems are designed for the maximum load current to be less than the sspc?s rated current (for margin), the actual power would be less than shown in table 4. for example, an sspc with a rated current of 25 amps, operated at a maximum load current of 20 amps would actually dissipate 4.95 watts (20 x 20 x 0.012 + 0.15). this is almost 36% less than the maximum specified in table 4. similarly, if the maximum baseplate temperature will be less than 100 c , the mosfet switch?s ?on? resistance will be less than the maximum, thereby reducing the power dissipation. as a result, in many cases, a heat sink will not be required. but, operating at maximum load currents and maximum baseplate temperatures will always require a heat sink. the maximum baseplate tem- perature with a heat sink can be calculated using the same for- mula as for without a heat sink, except that ca is replaced by the sum of the thermal resistance from junction-to-baseplate and baseplate-to-heat sink. notes: 1) status 1 indicates a logic low when the load is greater than programmed load detection value. see figure 4. 2) status 2 indicates a logic high when the power mosfet switch is on. 3) any trip condition per figure 5. 4) input control=control command and loc k out input . normal power out with load less than programmed load detection value h h h 8 load ?on?; showing normal ?on? condition. h l h 6 load ?off?; showing ?trip? (see note 3). l h h 7 sspc failure or short to ground on status 2 line. l l h 5 sspc failure or status 2 shorted to bias supply h h l 4 load ?off?; showing normal ?off? condition. l h l 3 load ?on?; showing sspc failure. h l l 2 sspc failure or short to ground. l l l 1 power controller and load status output status 2 (see note 2) output status 1 (see note 1) input control (see note 4) state table 6. status codes
11 data device corporation www.ddc-web.com rp-21200 d-02/04-0 coordination coordination requires that in a system using multiple levels of sspcs in a ?tree? configuration, the lowest level sspc will trip leaving the other sspcs untripped. for example, suppose a system has a 25 amp rp-21225 series sspc powering a bus which has multiple lower current rp-21200 series sspcs attached to it. if one of the lower current sspcs is rated at 10 amps and has an overload of 50 amps, the 10 amp sspc should trip but no other sspc should trip even though 50 amps exceeds the ratings of both sspcs. the star series of sspcs are designed to guarantee coordination. note that coordination is guar- anteed for a system that uses rp-21200 series, exclusively. lockout one of the concerns in using sspcs instead of electromechanical circuit breakers is maintenance safety. electromechanical circuit breakers give a visible indication that they are off allowing safe maintenance of a system. the concern is that when using sspcs, there is no such visible indication that the sspc is off and the pos- sibility that a malfunctioning controller could leave on sspcs which should be off, thereby creating a safety hazard during maintenance. to address this concern, the star series of sspcs are designed with a lockout input. when the lockout input is brought to a logic high, the sspc will be off, regardless of what is commanded on the control command input. in a system, the lockout inputs of all of the sspcs can be brought to a switch which can give a visible indication that the sspc is, in fact, in a safe, off state. there should be no concern that the lockout input must be brought to a logic high to guarantee the sspc is off; the logic high voltage should be the 5 volt bias power. that way, if the 5 volt bias power is lost, although the lockout input is no longer high, the sspc will still be off since it cannot operate without 5 volt bias power and is always off when that occurs. for additional safety, the control command has an internal pull- down resistor and the lockout input has an internal pull-up resis- tor (see figure 2). if either input is left unconnected, the rp- 21200 series of sspcs will default to the off state. advantages of the rp-21200 series the rp-21200 series use power mosfet technology as the switch. power mosfets have many advantages over electro- mechanical devices and over bipolar transistors used as switch- es. most important is the fact that, when the switch opens, there is no arcing. arcing wears out mechanical contacts since mate- rial is transferred from one contact to the other. in some cases, the very high temperatures caused by arcing can actually weld the contacts together, in which case the electromechanical device cannot open the circuit and the wire will overheat and fail, possibly causing a fire. arcing also causes high levels of emi. bipolar transistors are not as rugged as power mosfets. they exhibit ?secondary breakdown? which limits the current they can handle at maximum voltage without failing. power mosfets do not exhibit secondary breakdown and are limited only by their junction temperature rating. bipolar transistors also exhibit an offset due to their saturation voltage, v ce(sat) . power mosfets appear as simple resistors and their voltage drop is simply pro- portional to their operating current. the star series of sspcs are superior to solid-state relays. most solid-state relays have no protection feature; they are sim- ply switches. some solid-state relays will protect against short circuits but cannot protect against smaller overloads because they have no i 2 t circuits. since the rp-21200 series of sspcs have ttl/cmos-compatible inputs and outputs they are easy to interface to embedded micro- processor control. this allows automatic load control and automatic load shedding in emergency situations and allows for remote control. because the star series of sspcs have tighter trip tolerances than electromechanical circuit breakers, it?s not necessary to use as large a wire with these sspcs as with circuit breakers. this can save considerable weight which is especially important in airborne and space applications. parameter conditions unit value input offset current i load = 50% rated current % of rated current 2.0, max. gain ? volts per % of rated current vref/100, typ. gain error ? % of output 2.0, max. linearity error ? % of maximum output 0.5, max. reference voltage input current ? ma 0.26, typ.; 2.0, max. positive output swing i load = 200% of rated current v v bias -0.5, min. negative output swing i load = 0 v 0.02, typ.; 0.05, max. output resistance ? ohm 0.33, typ.; 0.46, max. slew rate i load = 20% to 80% of rated current step v/ s 0.24, typ.; 0.072, min. bandwidth i load = 80% of rated current khz 30.0, typ.; 15.0, min. table 7. optional analog current output (see notes) reference voltage input range (2) ? v 4.0 to v bias max. notes: 1. all typical values are at 25c; all minimum and maximum values apply from -55c to +100c. 2. must be supplied externally between 4.0v min. to v bias max.
12 data device corporation www.ddc-web.com rp-21200 d-02/04-0 isolation of the control circuit from the power circuit allows the rp-21200 series to be used in high-side and low-side and neg- ative as well as positive switching applications. isolation also prevents faults in the power side from propagating into the con- trol side thereby preventing damage to other system compo- nents. isolation also eliminates ?ground loop? problems which can result in false operation. paralleling of rp-21200 series while the star series takes advantage of the fact that power mosfets can be easily paralleled, it is not recommended that rp-21200 series sspcs be paralleled to obtain higher current ratings unless severe derating or attention to matching is observed. since the switches used in the star series are power mosfets which, when on, look simply like resistors, if two sspcs are placed in parallel, the current will divide between them. if the ?on? resistances of the mosfets in both units are not identical, the current will not divide equally. therefore, they cannot trip at the same point; the one with the lower ?on? resistance will carry a high- er current and will trip first. as soon as the first sspc trips, the second sspc will be carrying all of the current and it will trip. as a result, the two sspcs in parallel will not behave as one sspc with double the current rating. the current rating will be higher than one sspc alone, but it will be unpredictable. likewise, the trip curves vary from one sspc to the next. again, this will result in one sspc tripping before the other and an unpre- dictable trip point. while the programmability feature of the star series would allow the user to match the trip curves, this would not necessarily guarantee matching over the full temperature range. optional current monitor an optional analog current monitor, used for reporting the load current, can be special ordered from the factory. monitor details are shown in table 7. the optional current monitor provides a voltage output which is proportional to the load current. this current monitor contains an analog-to-digital converter, optical isolation and a digital-to- analog converter. the reference is brought out to a separate pin. this reference pin can be simply connected to the 5 volt bias pin. if the user attaches an external analog-to-digital con- verter to the current monitor output pin, then the best accuracy can be obtained by using the external converter?s reference for the current monitor?s reference. due to saturation characteristics of the output amplifier in the current monitor, the current monitor output cannot swing all of the way to ground or to the power supply (5 volt bias). therefore, it cannot monitor very low currents (1% of rated current) nor can it monitor very high currents (90%) when the 5 volt bias is used as the reference. when a reference voltage of 5 volt bias less 0.5 volts is used, the current monitor can monitor currents up to 100% of rated current; however, the lower limit remains. optional battle short an optional battle short control (pin 5) is available on the rp- 21225x2/3 and rp-21209x2/3 star series devices. the pin used for this option is normally a no connect for all other versions of the star series. the battle short can be enabled by grounding the battle short control pin to vbias supply common. to disable the function the pin should be left floating or pulled high to vbias. optional evaluation board an optional evaluation board is available and is outlined in fig- ure 7. contact factory for ordering information.
13 data device corporation www.ddc-web.com rp-21200 d-02/04-0 w3 w2 r1 r3 r2 1 slew_control 2 cur_mon_out 3 bias_gnd 4 vref 6 control 5 status_2 7 status_1 8 lockout 9 chassis_gnd 10 5v_bias j2 j1 u1 i3 current range preset i2 current range preset current range program input inst_trip_adj load_det_adj pwr_out 1a pwr_out 1b pwr_in 2a pwr_in 2b skt-90110 .450 '' max component height top view side view rp-212xxd1-300 (see note) 3 '' 11 16 3 16 2 '' 13 16 '' nylon standoff figure 7. optional evaluation board outline skt-90110 evaluation board and rp-21225d1 pin-out cross reference skt-90110 pin number 1a, 1b j1 1 power_out 2a, 2b j1 2 power_in 10 j2 3 vbias supply input 9 j2 4 chassis ground nc nc 5 no connection 8 j2 6 lock-out input 7 j2 7 status 1 output 6 j2 8 control command input 5 j2 9 status 2 output 4 j2 10 reference voltage input for optional current monitor 3 j2 11 bias supply common input 2 j2 12 optional current monitor output voltage 1 j2 20 slew control nc nc 13 no connection r2* 14 load detection program input (r2) open = 95%, short = 10% r3* 15 instant trip program input (r3) open = 200%, short = 3000% r2,r3,r1,w2,w3 16 programming reference r1* 17 current range program input (r1) open = 8.3a, short = 25a w2* 18 i2 current range preset input short = 20a w3* * please refer to figure 3, figure 4, and table 5 in data sheet for programming information. note: skt-90110 = evaluation board without sspc supplied skt-90110-1 = evaluation board with rp-21225d1 supplied skt-90110-2 = evaluation board with rp-21209d1 supplied skt-90110-3 = evaluation board with rp-21203d1 supplied 19 i3 current range preset input short = 12.5a skt-90110 connector rp-21225d1 pin number function comment
14 data device corporation www.ddc-web.com rp-21200 d-02/04-0 l1 l2 l3 star series tm rp - 212xxxx - xxx s/n 0201 9861 (usa) 20 3 1 2 isometric top view [flat package (f) shown] a a 0.05 (1.27) 0.675 (17.15) 0.675 (17.1) 0.25 (6.35) b d 17 equal spaces @ 0.075 = 1.275 (32.39) e mounting holes control terminals power terminals 0.02 (0.51) internal 4-40 thd x 5/64 deep (2 places) captive nuts not to protrude bottom 0.160 (4.06) 0.800 (20.3) pin 1 pin 2 pin 20 pin 3 a a c recommended thermal pad thickness = 0.020 (0.51) tie bar ( ) bottom view [flat package (f) shown] alternate lead configurations [gull lead (g) and through hole (d) packages shown] 0.08 ref. (2.03) 0.09 (2.29) 0.04 min. flat (1.02) both sides 0.17 (4.32) 0.17 ref (4.32) .19 (typ) (4.83) leads may be formed alternatively for plug-in .230 min. (5.84) f g h tie bar 0.02(typ) ( 0.51) both sides 0.020 (0.51) both sides figure 8. rp-21200 series mechanical outline package dimensions sspc model rp-21203 rp-21209 rp-21225 l1 (see note 1) 1.205 (30.61) 1.500 (38.10) 1.505 (38.23) l2 (see note 1) 1.505 (38.23) 1.500 (38.10) 2.205 (55.88) l3 (see note 2) 0.460 (11.68) 0.460 (11.68) 0.460 (11.68) a 0.262 (6.65) 0.262 (6.65) 0.125 (3.18) b 0.630 (16.00) 0.930 (23.62) 1.250 (31.75) c 0.930 (23.62) 0.930 (23.62) 1.950 (49.53) d 0.115 (2.92) 0.112 (2.84) 0.425 (10.80) e 0.260 (6.60) 0.260 (6.60) 0.505 (12.83) f 1.54 0.01 (39.12) 1.84 0.01(46.74) 1.84 0.01 (46.74) g 1.205 (30.61) 1.50 (38.10) 1.505 (38.10) h notes: - the models listed above are available with and without the analog current output option. - dimensions are in inches (mm). 1. typical dimensions; tolerance is 0.005 in (0.127). 2. max. dimensions. 1.38 0.01 (35.05) 1.68 0.01 (42.67) 1.68 0.01 (42.67)
bias supply- external 5v power supply used to power the sspc inter- nal circuitry. bit- built in test. coordination- if one or more sspc's are placed in a series circuit, the sspc with the lowest rated current will trip first during an over cur- rent condition. dielectric strength- the breakdown voltage rating, in vrms, of an elec- trical isolation barrier. emi- electromagnetic interference. i 2 t- expression that evaluates to a constant value. this constant defines the trip time of the sspc for any over current except those that would cause an instant trip. instant trip- condition where the sspc trips immediately without fol- lowing the i 2 t curve. this occurs when the sspc load current exceeds a predefined value. isolation- the d.c. resistance of an electrical isolation barrier, mea- sured with a known d.c. potential. leakage current- the current that flows into the load when the sspc is in the off state. lockout control- provides safe maintenance. when the lockout control is in the active state, the sspc must be off and shall not respond to the control input. max load capacitance- exceeding this load capacitance value may cause unwanted tripping. mosfet- metal oxide semiconductor field effect transistor. on resistance- effective resistance in ohms of the sspc between the power in and power out pins when the sspc is turned on. power dissipation- power in watts dissipated by the sspc. measured as ( vbias x ibias ) + ( voltage drop x load current ). rated current- maximum load current where the sspc will operate continuously without tripping. sspc- solid-state power controller sympathetic tripping- where any sspc in a system can cause any other sspc in the system to trip abnormally. ( ie. path through fet parasitic diode or induction transients ) sympathetic tripping is not desirable. thermal resistance- a measure of resistance to heat transfer. allows calculation of a device?s temperature rise above its mounting surface. specified in c/w. thermal memory- the ability of an sspc to account for the thermal energy retained in a wire or device. voltage drop- maximum voltage measured between the power in and power out pins with the power controller operating at its rated current. glossary 12 3 20 star series rp-212xxxx-xxx s/n 0201 9861 (usa) tm 12 3 20 pin # function 1 power out 2 power in 4 3 chassis ground (base) vbias supply input 5 not connected (battle short option) 6 lock-out input 7 status 1 output 8 control command input 9 status 2 output 10 reference voltage input for optional current monitor 11 bias supply common input 12 optional current monitor output voltage 13 not connected 14 load detection program input (r2) 15 instant trip (r3) program input 16 programming reference 17 current range program input (r1) 18 i2 current range preset input 19 i3 current range preset input 20 slew control input figure 9. pin-out details notes: 1. prototype units s/n 100-104 rp-21225f1-300p have pins numbered clock- wise. reference rp-212xx data sheet 01/16/99 or earlier. 2. figure 9 is now effective for all rp-21225 after s/n 104. 15 data device corporation www.ddc-web.com rp-21200 d-02/04-0
16 data device corporation www.ddc-web.com rp-21200 d-02/04-0 ordering information rp-212xxxx-xx0 process requirements: 0 = standard ddc processing, no burn-in (see table below) 2 = standard ddc processing, with burn-in (see table below) 7 = standard ddc processing, with burn-in, solder dip 9 = standard ddc processing with solder dip, no burn-in (see table below) temperature grade/data requirements: 1 = -55c to +100c 2 = -40c to +85c 3 = 0c to +70c 4 = -55c to +100c with variables test data 5 = -40c to +85c with variables test data 8 = 0c to +70c with variables test data options: 0 = standard product 1 = analog current monitor 2 = battle short without monitor 3 = battle short with monitor package: d = through hole f = flat package g = gull lead (contact factory for availability) current ranges: 03* = 1 to 3 amp programmable range 09 = 3 to 9 amp programmable range 25 = 8.3 to 25 amp programmable range *rp-21203xx-xx0 is not available with battle short. additional ordering information skt-xxxxx evaluation board: 90110 = evaluation board without sspc supplied 90110-1 = evaluation board with rp-21225d1-300 supplied 90110-2 = evaluation board with rp-21209d1-300 supplied 90110-3 = evaluation board with rp-21203d1-300 supplied ? ddc atp electrical test class 3 ipc-a-610 inspection / workmanship condition(s) method(s) test standard ddc processing for discrete modules/pc board assemblies
17 data device corporation www.ddc-web.com rp-21200 d-02/04-0 notes:
18 data device corporation www.ddc-web.com rp-21200 d-02/04-0 notes:
19 data device corporation www.ddc-web.com rp-21200 d-02/04-0 notes:
20 d-02/04-0 printed in the u.s.a. data device corporation registered to iso 9001:2000 file no. a5976 r e g i s t e r e d f i r m ? u this star series tm product information is subject to change. no responsibility is assumed by data device corporation for its use, and no license or rights are granted by implication or otherwise in connection therewith. 105 wilbur place, bohemia, new york, u.s.a. 11716-2482 for technical support - 1-800-ddc-5757 ext. 7771 headquarters, n.y., u.s.a. - tel: (631) 567-5600, fax: (631) 567-7358 southeast, u.s.a. - tel: (703) 450-7900, fax: (703) 450-6610 west coast, u.s.a. - tel: (714) 895-9777, fax: (714) 895-4988 united kingdom - tel: +44-(0)1635-811140, fax: +44-(0)1635-32264 ireland - tel: +353-21-341065, fax: +353-21-341568 france - tel: +33-(0)1-41-16-3424, fax: +33-(0)1-41-16-3425 germany - tel: +49-(0)8141-349-087, fax: +49-(0)8141-349-089 japan - tel: +81-(0)3-3814-7688, fax: +81-(0)3-3814-7689 world wide web - http://www.ddc-web.com

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